The TC Wafer Wafer Temperature Measurement System embeds high-temperature resistant thermocouple sensors on the wafer surface using independently developed core technologies, enabling real-time monitoring and recording of temperature change data during the wafer manufacturing process. It provides an efficient and reliable method for monitoring and optimizing key process parameters in semiconductor manufacturing.
Wafer Size | 2", 3", 4", 6", 8", 12" | Wafer Material | Silicon Wafer/Sapphire, etc. |
---|---|---|---|
Number of Temperature Measurement Points | 1-34 | Wire Length | L1-Internal Cavity; L2-Chamber Door Transition Section; L3-External Cavity |
Temperature Sensing Element | TC | Sampling Frequency | 1Hz |
TC Wire Diameter | 0.127mm/0.254mm | Supporting Host | Temperature Measurement System Host |
Temperature Range | K-type: RT~1200°C; R/S-type: RT~1200°C; T-type: RT~350°C; TR High-precision Type: -40-250°C / -40-350°C | ||
Temperature Accuracy | K-type: +1.1°C/0.4%; R/S-type: ±0.6°C/0.1%; T-type: 0.5°C; TR High-precision Type: 0.1°C/+0.5°C | ||
Temperature Measurement Software | Specialized software for real-time display of temperature field profiles and heating curves |