Machine Introduction:

This equipment is mainly used for cleaning micro-dust on the surface of wafers. It can effectively remove micro-dust particles on the surface of Holders, CMOS bodies, Wafers, etc. through high-pressure pure water flushing and water-gas two-fluid cleaning.

Cleaning Objects:

Cleaning of silicon, dust, and iron filings on the surface of mobile phone camera modules.

Cleaning Method:

Rotary two-fluid spray cleaning + centrifugal drying.

Machine Features:

• A special cleaning machine for dust and impurities on the wafer surface.

• Mirror stainless steel integrated closed body, causing no pollution to the working environment and suitable for the use requirements of dust-free workshops.

• Replaceable cleaning trays for cleaning various products, with the cleaning trays customized according to the products.

• PLC automatic control for convenient and quick operation.

• Transparent explosion-proof front door for safe operation and easy observation.

• Full-system instrument display to monitor the cleaning status at any time.

• Adopting two-fluid cleaning, featuring high cleaning precision, zero damage to products, and minimal pure water consumption.

• Rotary spray rod to avoid secondary pollution to products.

• Equipped with a static electricity elimination device and a cavity wall heating device to assist in achieving the best cleaning effect.

• Equipped with a 2-stage air filtration system, and the compressed air meets the ISO8573.1 standard.

• Compact body with a small footprint.

• Completely cleaned with ultrapure water, in line with the RoHS standard.

Product Parameters