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copyright © 2020 Shenzhen ondegao Electronic Technology Co., Ltd For the record,:ICP License: Guangdong No. 18096502
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Push-Pull Tester

The push-pull tester is used for tensile, compression, bending, tearing, and peeling tests in industries such as metal wires, metal foils, plastic films, wires and cables, adhesives, artificial boards, wires and cables, and waterproof materials. It is applied in laboratories and testing institutions for material testing and analysis.

Product introduction
Features
  1. Embedded PC and streamlined design save more space and are more aesthetically pleasing. The entire machine frame is made of new aviation aluminum, which is extremely strong, lightweight, and highly stable.

  2. The humanized motor-driven microscope ensures smooth movement of the focus along the arc path, providing a broader and clearer field of view.

  3. The resolution of any measurement module is 100ppm, ensuring the testing accuracy of each module. The system accuracy is 0.15%, and the Z-axis resolution is 0.1μm.

  4. An optional advanced digital image acquisition system can store images of defective products for error tracing and comparison.

  5. Rich data report output, multi-level user access, and multi-language setting switching.

  6. 200KGF die shear force and bump tensile force, optional Hi-Mag digital image acquisition card, and high-precision multi-range modules.

Specifications and Parameters

Dimension560×432×585 mm (H×W×D)
Weight55 kg
Power Supply90~264VAC, 47~63Hz
Air Source4.0~5.5 bar
Vacuum500 mm Hg
Servo Motor DriveX/Y standard, 305 mm×155 mm
X, Y Axis Resolution1 μm
Z Axis Resolution0.1 μm
System Accuracy0.15%
Step Accuracy1~25 μm
Toroidal Height MeasurementYes
Force CurveYes

Test Module Table

Test ModuleRangeOptional Ranges
Wire Tensile Force100 gf50 gf, 20 gf, 10 gf

1 kgf500 gf, 200 gf, 100 gf

10 kgf5 kgf, 2 kgf, 1 kgf
Die Shear Force20 kgf10 kgf, 5 kgf, 2 kgf

200 kgf100 kgf, 50 kgf, 20 kgf
Wire Bond Shear Force250 gf100 gf, 50 gf, 25 gf

1 kgf500 gf, 200 gf, 100 gf

5 kgf2 kgf, 1 kgf, 500 gf
Adhesive Strength 3-Point Test10 kgf5 kgf, 2 kgf, 1 kgf
Gold Ball Thrust Force100 gf5 gf, 20 gf, 10 gf
Clamp Tensile Force1 kgf500 gf, 200 gf, 100 gf

10 kgf5 kgf, 2 kgf, 1 kgf

Electric Microscope

The microscope can be adjusted to a comfortable height by pressing the front panel switch. The motor-driven microscope maintains smooth movement along the arc path of its focus. There are no adjustment knobs or digital tables to refer to.

Large-Area Servo X/Y

The X-axis movement exceeds 300 mm, and the Y-axis movement exceeds 150 mm, making the Royce 650 easily adapt to 300 mm wafers, lead frames, and large electronic components. The high-speed axis allows for solder ball shear testing and quick test piece positioning.

Ultra-Small Pitch

High-precision optics and sub-micron X/Y resolution provide highly repeatable ultra-small pitch testing. An optional 128X microscope enables on-site monitoring. The integrated computer is suitable for small cleanrooms, as cleanrooms are costly. The 650 integrates a high-standard, high-precision Windows PC in addition to the worktable, offering an easy-to-use package. Your IT department will also welcome a system from the same source.

Rich Data Reports

Reports can be generated in CSV, XLS, or PDF formats. Built on an SQL database, they can be queried using the Royce query tool. Data can be exported to network drives, printers, built-in DVD-CD R/W drives, provided USB drives, or RS232 serial ports.

Multi-Level Access

Process engineers should have full information for machine operation and installation, while production operators should have limited access. To meet various user access needs, process engineers can set permission levels for each user type. Many different permissions can be set, but 2 or 3 are usually sufficient. Access permissions are automatically set upon user login.

Multi-Language Support

Languages can be switched with a mouse click. Multiple languages are supported, including Traditional Chinese, Simplified Chinese, Japanese, Korean, German, French, and English. Other languages can also be easily installed.

Other Features

  • 200KGF die shear force and bump tensile force

  • Optional Hi-Mag digital image acquisition card

  • High-precision range modules


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