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French METRONELEC Automatic Solderability Tester ST88 NEO

The French METRONELEC automatic solderability tester ST88 NEO can test various components affecting the soldering process, including various types of surface mount devices, through-hole devices, printed circuit boards, fluxes, solder pastes, etc.

Product introduction

Product Introduction

The ST88 NEO solderability tester/tin dipping balance/wetting balance can quickly, accurately, and objectively judge the solderability of the tested samples; quantify and output solderability results in units of wetting force and wetting angle, directly reflecting the sample's solderability. It can minimize the impact of external operations on test results, ensure testing accuracy, and maximize the direct comparison of solderability between different samples through the wetting angle method. The ST88 NEO is also recommended by relevant solderability test standards such as IPC/IEC/NF.


The ST88 NEO solderability tester/tin dipping balance/wetting balance connects the tested sample to the sensor through a fixture, immerses it into the alloy at a set temperature under set speed, angle, and time conditions. During this period, it transmits data such as force and time to the computer software through the sensor, forming curves and data files of wetting angle vs. time or wetting force vs. time, which can quantitatively and qualitatively evaluate the "good or bad" solderability of the sample and serve as a quality basis for incoming materials or factory shipments of solderability.

Specifications and Parameters

Immersion Speed0.1-50 mm/s
Immersion Depth0.01-15 mm
Immersion Time3 - 9999 s
Withdrawal Speed0.1-50 mm/s
Solder Pot Diameter80 mm
Solder Pot Capacity2 kg
Solder Ball Diameter (mm)1, 2, 3.2 & 4 mm
Temperature Range0-450°C
Temperature Control Accuracy±1°C
Sensor Linearity1%
Sensor Accuracy0.001 mN
Wetting Force Range0 - 1 mN - 40 mN or customized
Position SensorStandard configuration
Z-Axis Displacement Accuracy0.01 mm
Operating SoftwareWindows 10
Equipment Dimensions310 x 500 x 7200 (Note: Please confirm whether the dimension data is accurate.)
Power Input110-220VAC, 50/60Hz
Nitrogen Inlet4-6 bar, 4-6 mm conduit
Nitrogen ConsumptionTBC (To Be Confirmed)
Net Weight of Equipment40 kg
LanguagesEnglish, French, German, Chinese, etc.

Solder Pot Module

  • Conventional component testing.

  • PCB test piece testing.

  • Flux/alloy characteristic measurement.

  • Immersion and appearance testing.

Ball Module

  • Includes four sizes (1, 2, 3.2, and 4 mm) on the same module.

  • X and Y electric worktable.

  • No waiting for temperature when switching.

CMS and Small Component Testing

  • PCB test piece testing.

Image Capture

  • Video system with 2 cameras for recording test videos.

Inert Gas Chamber

  • Multimedia system shared in the same software:

    • Curves expressed in force, force/circumference, or wetting angle.

    • Statistical analysis, average value, sigma.

    • Easy export of all data using Windows clipboard®.

Compliance with All International Standards

  • IPC/EIA J-STD 002&003

  • JEDEC MIL 883L

  • IEC 68-2-69

  • IEC 68-2-58

  • NFC 89-400

  • User-defined standards


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