Machine Introduction:
This equipment is mainly used for cleaning micro-dust on the surface of wafers. It can effectively remove micro-dust particles on the surface of Holders, CMOS bodies, Wafers, etc. through high-pressure pure water flushing and water-gas two-fluid cleaning.

Cleaning Objects: Cleaning of silicon, dust, and iron filings on the surface of mobile phone camera modules;

Cleaning Method: Rotary two-fluid spray cleaning + centrifugal drying;

Machine Features:
● Special cleaning machine for dust and impurities on the wafer surface;
● Mirror stainless steel integrated closed body, no pollution to the working environment, suitable for the use requirements of dust-free workshops;
● Replaceable cleaning trays for cleaning various products, and the cleaning trays are customized according to the products;
● PLC automatic control, convenient and quick operation;
● Transparent explosion-proof front door for safe operation and easy observation;
● Full-system instrument display to monitor the cleaning status at any time;
● Adopting two-fluid cleaning, with high cleaning precision, zero damage to products, and minimal pure water consumption;
● Rotary spray rod to avoid secondary pollution to products;
● Equipped with static electricity elimination device and cavity wall heating device to assist in achieving the best cleaning effect;
● Equipped with a 2-stage air filtration system, and the compressed air meets ISO8573.1 standard;
● Compact body with a small footprint;
● Completely cleaned with ultrapure water, in line with RoHS standards.

Product Parameters