The wafer-type vibration level measurement calibration chip integrates multiple sensor modules onto the wafer through professional technology, enabling rapid measurement of parameters such as acceleration, vibration, levelness, and leveling angle. The real-time level detection system can quickly measure the inclination parameters of wafer cassettes, FOUPs, wafer automated handling robots, wafer calibration equipment, load locks, wafer ejectors, and process chamber bases. The real-time vibration detection system monitors wafer sliding, slippage, collision, scratches, and rough handling without interrupting machine operations. The application of AVLS in the semiconductor manufacturing field helps improve equipment debugging efficiency and production process control accuracy.
Application Scope:
Wafer Cassettes, FOUPs, Wafer Automated Handling Robots, Wafer Calibration Equipment, Load Locks, Wafer Ejectors, Process Chamber Bases, Overhead Crane Handling Systems, Wafer Loading and Detection Integrated Devices (SMIF)