Functional Features

1. Clean and activate the substrate surface, increase the substrate surface dyne coefficient, enhance substrate adhesion, improve the pass rate of precision products, and eliminate surface static electricity of the substrate.

2. Automatically adjust the width, the processing range and height can be set, and products with fixtures can pass through.

3. The plasma output temperature is low during surface treatment, which will not damage the substrate.

4. The product has dual functions. When the substrate product does not need surface treatment, it can automatically adjust the width and adopt a direct-through mode.

5. Do not damage the processed product devices.

Application Scope
Plasma surface cleaning and activation treatment are widely used in various non-conductive and conductive substrates.

1. Wire Bonding gold finger cleaning and activation.

2. Cleaning and activation before PCBA three-proof coating, improving the surface dyne value and enhancing adhesive adhesion.

3. Pad cleaning and surface activation treatment before PCB solder paste printing to enhance solder melting and curing adhesion.

4. Wafer cleaning.

5. Substrate cleaning before COF and Mini-LED dispensing and mounting, etc.

Features of Plasma Surface Activation System
Features

1. The plasma host and motion cabinet are independently developed, with independent intellectual property rights for software and hardware.

2. According to the different appearance and shape of customers' products, plasma nozzles of different shapes and sizes can be configured.

3. According to customers' production requirements for processing efficiency, multiple heads can be configured and the single-machine power can be set.

4. This system has a high and stable plasma output, which can ensure the consistency of the processing effect of products.

5. The plasma output temperature is low, which will not damage the processed products, and the effect before and after processing is remarkable, etc.

Application Fields
5G
PCBA three-proofing/dispensing, gold finger cleaning
PCB solder paste printing/FPC printed circuit board (flexible board)
Mini-LED
LCD assembly
Semiconductor core
Medical products
Automotive spraying/automotive electronics

Plasma Cleaning Principle (Principle)

1. The principle of plasma cleaning: Applying sufficient energy to the gas to ionize it makes it in a plasma state. The "active" components of the plasma include ions, electrons, active groups, excited nuclides (metastable states), photons, etc. The plasma cleaning machine processes the surface of the sample by using the properties of these active components to achieve the effects of cleaning, etching, activation, etc. on the material surface.

Physical Activate Introduce
Cleaning Bond Functional Groups
(1) Etching effect on the material surface - physical effect:
A large number of active particles such as ions, excited molecules, and free radicals in the plasma act on the surface of the solid sample, which not only removes the original pollutants and impurities on the surface but also produces an etching effect, making the surface of the sample rough and forming many fine pits, increasing the specific surface area of the sample and improving the wetting performance of the solid surface.

(2) Activation of bond energy - cross-linking effect:
The energy of particles in the plasma is 0-20 eV, and the bond energy of most polymers is 0-10 eV. Therefore, after the plasma acts on the solid surface, the original chemical bonds on the solid surface can be broken, and the free radicals in the plasma form a network cross-linking structure with these bonds, greatly activating the surface activity.

(3) Formation of new functional groups - chemical effect:
If a reactive gas is introduced into the discharge gas, complex chemical reactions will occur on the activated material surface, introducing new functional groups such as alkyl, amino, carboxyl, etc. These functional groups are active groups, which can significantly improve the surface activity of the material.

2. The principle of plasma equipment: The structure of the plasma cleaning machine is mainly composed of four parts: control system, excitation power supply system, XYZ three-axis power system, and process gas system.